Low temperature-cured electrically conductive pastes for interconnection on electronic devices
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lim, HS (Lim, Ho Sun) | - |
dc.contributor.author | Kim, SN (Kim, Seung-Nam) | - |
dc.contributor.author | Lim, JA (Lim, Jung Ah) | - |
dc.contributor.author | Park, SD (Park, Seong-Dae) | - |
dc.date.accessioned | 2022-04-19T10:26:02Z | - |
dc.date.available | 2022-04-19T10:26:02Z | - |
dc.date.issued | 2012-10 | - |
dc.identifier.issn | 0959-9428 | - |
dc.identifier.issn | 1364-5501 | - |
dc.identifier.uri | https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/147664 | - |
dc.description.abstract | Highly conductive pastes were prepared by thermal sintering of silver particles into a polymer matrix. These electrically conductive pastes are composed of a novolac epoxy resin and a trimodal metallic mixture of micron-sized silver flakes, silver microspheres, and silver nanoparticles and can be cured at relatively low temperatures. Our strategy is to cure the epoxy resins at a higher temperature than the sintering temperature of the silver powders to form a good metallic network of the conductive materials. We found that our epoxy-based conducting pastes had a low volume resistivity and high electrical conductivity of 8.9 x 10(-6) Omega cm and 1.1 x 10 5 S cm(-1), respectively, even at a low curing temperature of 250 degrees C. The resulting high conductivity may be attractive for numerous applications in various optoelectronic devices that require low-temperature processing. | - |
dc.format.extent | 6 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | ROYAL SOC CHEMISTRY | - |
dc.title | Low temperature-cured electrically conductive pastes for interconnection on electronic devices | - |
dc.type | Article | - |
dc.publisher.location | 영국 | - |
dc.identifier.doi | 10.1039/c2jm33168c | - |
dc.identifier.scopusid | 2-s2.0-84870425860 | - |
dc.identifier.wosid | 000308658600061 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MATERIALS CHEMISTRY, v.22, no.38, pp 20529 - 20534 | - |
dc.citation.title | JOURNAL OF MATERIALS CHEMISTRY | - |
dc.citation.volume | 22 | - |
dc.citation.number | 38 | - |
dc.citation.startPage | 20529 | - |
dc.citation.endPage | 20534 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
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