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Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering

Authors
Young-Seok SONShin, Jee Young
Issue Date
May-2003
Publisher
Japan Society of Mechanical Engineers/Nihon Kikai Gakkai
Citation
JSME International Journal, Series B: Fluids and Thermal Engineering, v.46, no.2, pp 308 - 315
Pages
8
Journal Title
JSME International Journal, Series B: Fluids and Thermal Engineering
Volume
46
Number
2
Start Page
308
End Page
315
URI
https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/149160
DOI
10.1299/jsmeb.46.308
ISSN
1340-8054
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공과대학 > 기계시스템학부 > 1. Journal Articles

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