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Ecofriendly Catechol Lipid Bioresin for Low-Temperature Processed Electrode Patterns with Strong Durability

Authors
Lee, BoraHan, HyemiHahn, Hoh-GyuDoh, Jeong MannPark, Se-HoonLee, EunjiLee, Sang-SooPark, CheolminLim, Ho SunLim, Jung Ah
Issue Date
Apr-2020
Publisher
AMER CHEMICAL SOC
Keywords
catechol lipid; urushiol lacquer; conducting composite; conducting adhesive; silver paste
Citation
ACS APPLIED MATERIALS & INTERFACES, v.12, no.14, pp 16864 - 16876
Pages
13
Journal Title
ACS APPLIED MATERIALS & INTERFACES
Volume
12
Number
14
Start Page
16864
End Page
16876
URI
https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/2478
DOI
10.1021/acsami.0c00199
ISSN
1944-8244
1944-8252
Abstract
We demonstrated catechol lipid-based bioresin, which is collected from lacquer trees, to produce conductive pastes that can be processed at low temperatures, which are highly adhesive and multidurable. Our conductive paste, which consists of catechol lipid-based urushiol resin and a multimodal mixture of silver fillers, exhibited stable dispersion with shear thinning properties. The urushiol lacquer induced spontaneous reduction of silver salt at the surface of the silver fillers, thereby contributing to lower the contact resistance between conductive fillers in the electrical conduction. Furthermore, the directional volume shrinkage of the urushiol lacquer matrix in a cross-linking reaction resulted in a highly ordered microstructure of the silver fillers with layer-by- layer stacking of the silver flakes. This structure contributed to the improvement of the electrical contact between fillers as well as excellent mechanical hardness, anti-scratch capability, and the long-term environmental stability of the conductive films. Conductive films based on the silver paste with urushiol lacquer exhibited low electrical resistivity below 4.4 x 10(-5) Omega cm, 5B-class strong adhesion strength, and high hardness exceeding 200 MPa. Finally, we demonstrated the facile room-temperature processability and screen printability of the UL-Ag paste by fabricating a printed antenna and three-dimensional (3D) electrode assembly based on a plastic 3D block.
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