Bending Sensor Based on Controlled Microcracking Regions for Application toward Wearable Electronics and Robotics
  • Lee, Do Hoon
  • Yang, Jun Chang
  • Sim, Joo Yong
  • Kang, Heemin
  • Kim, Hyung-Ryong
  • 외 1명
Citations

WEB OF SCIENCE

37
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36

초록

A soft bending sensor based on the inverse pyramid structure is demonstrated, revealing that it can effectively suppress microcrack formation in designated regions, thus allowing the cracks to open gradually with bending in a controlled manner. Such a feature enabled the bending sensor to simultaneously have a wide dynamic range of bending strain (0.025-5.4%), high gauge factor (~74), and high linearity (R-2 ~ 0.99). Furthermore, the bending sensor can capture repeated instantaneous changes in strain and various types of vibrations, owing to its fast response time. Moreover, the bending direction can be differentiated with a single layer of the sensor, and using an array of sensors integrated on a glove, object recognition was demonstrated via machine learning. Finally, a self-monitoring proprioceptive ionic electroactive polymer (IEAP) actuator capable of operating in liquid was demonstrated. Such features of our bending sensor will enable a simple and effective way of detecting sophisticated motion, thus potentially advancing wearable healthcare monitoring electronics and enabling proprioceptive soft robotics.

키워드

bending sensorinverse pyramidhealthcare monitoringtactile object recognitionsoft roboticsSTRAIN SENSORSPRESSURESKIN
제목
Bending Sensor Based on Controlled Microcracking Regions for Application toward Wearable Electronics and Robotics
저자
Lee, Do HoonYang, Jun ChangSim, Joo YongKang, HeeminKim, Hyung-RyongPark, Steve
DOI
10.1021/acsami.2c07795
발행일
2022-07
유형
Article
저널명
ACS Applied Materials and Interfaces
14
27
페이지
31312 ~ 31320