Flexible integrated OLED substrates prepared by printing and plating process

초록

We developed a cost- effective process to fabricate a flexible integrated organic light- emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels. (C) 2017 Elsevier B.V. All rights reserved.

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