전도성 입자의 형태가 감광성 실버 페이스트의 미세 전극 패턴 형성에 미치는 영향
Effect of Conductive Filler Shape on Fine Electrode Pattern of Photosensitive Silver Pastes
Citations

WEB OF SCIENCE

1
Citations

SCOPUS

1

초록

Photosensitive silver pastes were developed using a mixture of spherical and flake-type silver particles for fine electrode patterns with high electrical conductivity, and the electrical characteristics were evaluated as a function of particle shape. The photosensitive silver pastes mixed up novolac epoxy-modified acrylate oligomer, acrylate monomer, and photoinitiator as a photocurable and alkali-developable binder resin composition, and silver spheres and flakes as conductive fillers. With a increase of silver loading amount the volume resistance decreased due to enhancement of packing density between the conductive fillers, where the conductive paste with 88 wt% silver sphere content showed 1.14× 10-4 Ω·cm. When the silver particles loading and sphere to flake ratio were 84 wt% and 8:2, the volume resistance exhibited 7.04×10-5 Ω·cm. This result was attributed to improvement of electrical contacts between silver spheres by flakes.

제목
전도성 입자의 형태가 감광성 실버 페이스트의 미세 전극 패턴 형성에 미치는 영향
제목 (타언어)
Effect of Conductive Filler Shape on Fine Electrode Pattern of Photosensitive Silver Pastes
저자
임호선최학렬김범준박성대
DOI
10.7317/pk.2015.39.4.662
발행일
2015-07
저널명
폴리머
39
4
페이지
662 ~ 667