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Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection
- 손영석;
- 신지영
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8Citations
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11키워드
numerical analysisthermal responseelectronic assemblyforced convection-infrared reflow solderingair injectionparametric study
- 제목
- Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection
- 저자
- 손영석; 신지영
- 발행일
- 2005-11
- 권
- 48
- 호
- 4
- 페이지
- 865 ~ 873
- 언어
- ENG
- 출판사
- JPNSOCOFMECHANICALENGINEERS
- 발행국가
- 일본
- 분량
- 9 페이지
- ISSN
- P 1340-8054