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Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering
- Young-Seok SON;
- Shin, Jee Young
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1- 제목
- Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering
- 저자
- Young-Seok SON; Shin, Jee Young
- 발행일
- 2003-05
- 권
- 46
- 호
- 2
- 페이지
- 308 ~ 315
- 언어
- ENG
- 출판사
- Japan Society of Mechanical Engineers/Nihon Kikai Gakkai
- 발행국가
- 일본
- 분량
- 8 페이지
- ISSN
- P 1340-8054