ScholarWorks@숙명여자대학교

초록

This study focuses on developing low-dielectric-loss silica-based polydimethylsiloxane (PDMS) composite films for application in 5G printed circuit boards. With the increasing demand for high-frequency, high-speed communication systems such as 5G and beyond, materials with superior dielectric properties are essential for minimizing signal degradation. In this study, we fabricated composite films using PDMS and varying weight percentages (10–60 wt%) of silica fillers (MS5000 and MS1000). The dielectric properties, mechanical strengths, and thermal stabilities of the films were investigated. The results reveal that the dielectric constant of the films increased with increasing filler content, while the dielectric loss decreased. Specifically, films containing 10 wt.% of MS5000 and MS1000 exhibited dielectric constants of 2.9135 and 2.8760, respectively, whereas films containing 60 wt.% of the same fillers demonstrated dielectric losses of 0.0154 and 0.0149, respectively. Additionally, the thermal stability of the films improved with increasing silica content, and mechanical testing showed that while the elongation decreased,Young’s modulus increased, highlighting the tradeoff between flexibility and stiffness. These findings indicate that by optimizing the filler content, PDMS–silica composite films could be promising for high-frequency applications in 5G communication systems.

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