Fabrication of multifunctional wearable interconnect E-textile platform using direct ink writing (DIW) 3D printing
  • Pak, Kyusoon
  • Yang, Jun Chang
  • Sim, Joo Yong
  • Lee, Taehoon
  • Lee, Do Hoon
  • 외 5명
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초록

Textiles, integral to human life for centuries, have recently garnered significant interest for electronic applications. However, traditional fabrication methods for electronic textiles (E-textiles) are typically complex. This research introduces an innovative approach utilizing Direct Ink Writing (DIW) 3D printing to develop multifunctional wearable electronic textiles. Specifically, the study addresses the creation of a strain sensor and an interconnect electrode directly printed onto textile substrates. The DIW-printed strain sensor exhibited excellent sensitivity, achieving a gauge factor of 11.07, significant linearity (R-2 similar to 0.99), and consistent performance under repeated mechanical stress. Additionally, the interconnect electrode was engineered to selectively bridge textile layers through controlled impregnation, resulting in stable resistance values (0.2-0.4 Omega) under strain and pressure. These components were effectively incorporated into smart garments, facial masks, and multilayered gloves, enabling precise real-time monitoring of body movements, respiration, and tactile recognition, thus significantly advancing functionality and versatility in wearable electronics.

제목
Fabrication of multifunctional wearable interconnect E-textile platform using direct ink writing (DIW) 3D printing
저자
Pak, KyusoonYang, Jun ChangSim, Joo YongLee, TaehoonLee, Do HoonLee, SeungkyuKang, MinjooOh, ByungkookKim, Jin-OhPark, Steve
DOI
10.1038/s41528-025-00414-7
발행일
2025-05
유형
Article
저널명
NPJ FLEXIBLE ELECTRONICS
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