상세 보기
- Pak, Kyusoon;
- Yang, Jun Chang;
- Sim, Joo Yong;
- Lee, Taehoon;
- Lee, Do Hoon;
- 외 5명
WEB OF SCIENCE
10SCOPUS
10초록
Textiles, integral to human life for centuries, have recently garnered significant interest for electronic applications. However, traditional fabrication methods for electronic textiles (E-textiles) are typically complex. This research introduces an innovative approach utilizing Direct Ink Writing (DIW) 3D printing to develop multifunctional wearable electronic textiles. Specifically, the study addresses the creation of a strain sensor and an interconnect electrode directly printed onto textile substrates. The DIW-printed strain sensor exhibited excellent sensitivity, achieving a gauge factor of 11.07, significant linearity (R-2 similar to 0.99), and consistent performance under repeated mechanical stress. Additionally, the interconnect electrode was engineered to selectively bridge textile layers through controlled impregnation, resulting in stable resistance values (0.2-0.4 Omega) under strain and pressure. These components were effectively incorporated into smart garments, facial masks, and multilayered gloves, enabling precise real-time monitoring of body movements, respiration, and tactile recognition, thus significantly advancing functionality and versatility in wearable electronics.
- 제목
- Fabrication of multifunctional wearable interconnect E-textile platform using direct ink writing (DIW) 3D printing
- 저자
- Pak, Kyusoon; Yang, Jun Chang; Sim, Joo Yong; Lee, Taehoon; Lee, Do Hoon; Lee, Seungkyu; Kang, Minjoo; Oh, Byungkook; Kim, Jin-Oh; Park, Steve
- 발행일
- 2025-05
- 유형
- Article
- 저널명
- NPJ FLEXIBLE ELECTRONICS
- 권
- 9
- 호
- 1