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Parametric Study on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering
- 제목
- Parametric Study on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering
- 저자
- Shin, Jee Young
- 학회명
- 14th International Conference on Thermal Engineering and Thermogrammetry
- 개최지
- 부다페스트
- 개최국가
- 헝가리
- 학회 개최일
- 2005-06-22 ~ 2005-06-24