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Hierarchical Multiplexing Interconnection Structure for Fault-Tolerant Reconfigurable Chip Multiprocessor

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dc.contributor.authorKim, Yoonjin-
dc.date.available2021-02-22T13:15:46Z-
dc.date.issued2011-12-
dc.identifier.issn1598-1657-
dc.identifier.issn2233-4866-
dc.identifier.urihttps://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/12440-
dc.description.abstractStage-level reconfigurable chip multiprocessor (CMP) aims to achieve highly reliable and fault tolerant computing by using interwoven pipeline stages and on-chip interconnect for communicating with each other. The existing crossbar-switch based stage-level reconfigurable CMPs offer high reliability at the cost of significant area/ power overheads. These overheads make realizing large CMPs prohibitive due to the area and power consumed by heavy interconnection networks. On other hand, area/ power-efficient architectures offer less reliability and inefficient stage-level resource utilization. In this paper, I propose a hierarchical multiplexing interconnection structure in lieu of crossbar interconnect to design area/ power-efficient stage-level reconfigurable CMP. The proposed approach is able to keep the reliability offered by the crossbar-switch while reducing the area and power overheads. Experimental results show that the proposed approach reduces area by up to 21% and power by up to 32% when compared with the crossbar-switch based interconnection network.-
dc.format.extent11-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEK PUBLICATION CENTER-
dc.titleHierarchical Multiplexing Interconnection Structure for Fault-Tolerant Reconfigurable Chip Multiprocessor-
dc.typeArticle-
dc.publisher.location대한민국-
dc.identifier.doi10.5573/JSTS.2011.11.4.318-
dc.identifier.scopusid2-s2.0-84855453465-
dc.identifier.wosid000301291600013-
dc.identifier.bibliographicCitationJOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v.11, no.4, pp 318 - 328-
dc.citation.titleJOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE-
dc.citation.volume11-
dc.citation.number4-
dc.citation.startPage318-
dc.citation.endPage328-
dc.type.docTypeArticle-
dc.identifier.kciidART001643963-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusAREA-
dc.subject.keywordAuthorChip multiprocessor (CMP)-
dc.subject.keywordAuthorreconfigurable architecture-
dc.subject.keywordAuthorinterconnection-
dc.subject.keywordAuthorfault-tolerant computing-
dc.subject.keywordAuthorlow power-
dc.identifier.urlhttps://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01754976&language=ko_KR-
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공과대학 (소프트웨어학부(첨단))
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