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OMNIDIRECTIONAL POLYHEDRAL ULTRASOUND TRANSDUCER FOR POWERING IMPLANTABLE MICRODEVICES

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dc.contributor.authorIslam, Sayemul-
dc.contributor.authorPark, Moonchul-
dc.contributor.authorSong, Seung Hyun-
dc.contributor.authorKim, Albert-
dc.date.accessioned2022-04-19T08:54:10Z-
dc.date.available2022-04-19T08:54:10Z-
dc.date.issued2021-06-
dc.identifier.issn2167-0013-
dc.identifier.issn2167-0021-
dc.identifier.urihttps://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/146173-
dc.description.abstractUltrasonic powering is an emerging power source for implantable microdevices due to its superior efficiency in energy transfer at millimeter-scale, long operation distance, and near omnidirectionality. In this paper, we investigate a novel polyhedral ultrasound transducer with emphasis on angular alignment between piezoelectric poling vector and incident waves. Three different polyhedrons (i.e., sphere, octahedron, and dodecahedron) are fabricated via 3D printing lead-free barium titanate ceramic. The maximum output voltage for a unit area occurred at 0 degrees when the poling and waves direction aligned, which were measured to be 0.677 +/- 0.071, 1.058 +/- 0.049, and 0.709 +/- 0.092 V, respectively. At the extreme angular misalignment at 90 degrees (poling and waves perpendicular to each other), only the dodecahedron could sustain the voltage output with 21% reduction, whereas sphere and octahedron dropped by 46%. The results imply that the geometry factor may overcome the poling vector, enabling omnidirectional ultrasonic powering for implantable microdevices.-
dc.format.extent4-
dc.language영어-
dc.language.isoENG-
dc.publisherIEEE-
dc.titleOMNIDIRECTIONAL POLYHEDRAL ULTRASOUND TRANSDUCER FOR POWERING IMPLANTABLE MICRODEVICES-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/TRANSDUCERS50396.2021.9495556-
dc.identifier.scopusid2-s2.0-85114962100-
dc.identifier.bibliographicCitation2021 21ST INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), pp 1404 - 1407-
dc.citation.title2021 21ST INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS)-
dc.citation.startPage1404-
dc.citation.endPage1407-
dc.type.docTypeProceedings Paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordAuthorUltrasonic powering-
dc.subject.keywordAuthorbarium titanate-
dc.subject.keywordAuthorpiezoelectric-
dc.subject.keywordAuthoromnidirectional-
dc.subject.keywordAuthorwireless powering-
dc.subject.keywordAuthorimplantable-
dc.subject.keywordAuthormicrodevice-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9495556-
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첨단소재·전자융합공학부 (지능형전자시스템전공)
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