Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 손영석 | - |
dc.contributor.author | 신지영 | - |
dc.date.accessioned | 2022-04-19T11:41:58Z | - |
dc.date.available | 2022-04-19T11:41:58Z | - |
dc.date.issued | 2005-11 | - |
dc.identifier.issn | 1340-8054 | - |
dc.identifier.uri | https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/148719 | - |
dc.format.extent | 9 | - |
dc.language | 영어 | - |
dc.language.iso | ENG | - |
dc.publisher | JPNSOCOFMECHANICALENGINEERS | - |
dc.title | Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection | - |
dc.type | Article | - |
dc.publisher.location | Japan | - |
dc.identifier.doi | 10.1299/jsmeb.48.865 | - |
dc.identifier.scopusid | 2-s2.0-33646851445 | - |
dc.identifier.wosid | 000234376500031 | - |
dc.identifier.bibliographicCitation | JSME INTERNATIONAL JOURNAL SERIES B-FLUIDS AND THERMAL ENGINEERING, v.48, no.4, pp 865 - 873 | - |
dc.citation.title | JSME INTERNATIONAL JOURNAL SERIES B-FLUIDS AND THERMAL ENGINEERING | - |
dc.citation.volume | 48 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 865 | - |
dc.citation.endPage | 873 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | sci | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | ThermodynamicsEngineering | - |
dc.relation.journalWebOfScienceCategory | ThermodynamicsEngineering, Mechanical | - |
dc.subject.keywordAuthor | numerical analysisthermal responseelectronic assemblyforced convection-infrared reflow solderingair injectionparametric study | - |
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