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[Ni/Mn] superlattice-based spin-valves with high thermal stabilities

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dc.contributor.authorChoi, KL-
dc.contributor.authorKim, KM-
dc.contributor.authorLee, NI-
dc.contributor.authorKim, MY-
dc.contributor.authorRhee, JR-
dc.contributor.authorLee, SS-
dc.contributor.authorHwang, DG-
dc.contributor.authorPark, CM-
dc.date.available2021-02-22T16:47:54Z-
dc.date.created2020-09-01-
dc.date.issued1999-09-
dc.identifier.issn0018-9464-
dc.identifier.urihttps://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/16821-
dc.description.abstractNi/Mn superlattice-based spin-valve films were fabricated by de sputtering method. Coercivity (H-c) of the pinned layer and exchange coupling field (H-ex) between the pinned layer and pinning Ni/Mn superlattice with an antiferromagnetic phase were investigated in order to optimize the deposition conditions and annealing profess. The thickness of each layer was controlled by deposition time. The H-ex and H-c of Ni/Mn superlattice-based spin-valves increased gradually with the number of annealing cycles and number of bilayers. At the Ni composition of 38 at. % for the annealing time of 12 hours, the largest H-ex and H-c of glass/[Ni/Mn](80)/NiFe(60 Angstrom)/Cu(30 Angstrom)/NiFe(60 Angstrom) spin-valves are 305 Oe and 245 Oe, respectively. However, the magnetoresistance (MR) ratio is small, due to the shunting effect of Ni/Mn superlattice and the interdiffusion between NiFe and Cu.-
dc.language영어-
dc.language.isoen-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.title[Ni/Mn] superlattice-based spin-valves with high thermal stabilities-
dc.typeArticle-
dc.contributor.affiliatedAuthorRhee, JR-
dc.identifier.doi10.1109/20.801038-
dc.identifier.scopusid2-s2.0-0033184331-
dc.identifier.wosid000083151100230-
dc.identifier.bibliographicCitationIEEE TRANSACTIONS ON MAGNETICS, v.35, no.5, pp.2943 - 2945-
dc.relation.isPartOfIEEE TRANSACTIONS ON MAGNETICS-
dc.citation.titleIEEE TRANSACTIONS ON MAGNETICS-
dc.citation.volume35-
dc.citation.number5-
dc.citation.startPage2943-
dc.citation.endPage2945-
dc.type.rimsART-
dc.type.docTypeArticle; Proceedings Paper-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
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