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Parametric Study on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Shin, Jee Young | - |
| dc.date.accessioned | 2021-10-26T02:44:12Z | - |
| dc.date.available | 2021-10-26T02:44:12Z | - |
| dc.identifier.uri | https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/55903 | - |
| dc.title | Parametric Study on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering | - |
| dc.type | Conference | - |
| dc.citation.title | Scientific Society of Measurement, Automation and Thermogrammetry 발표집 | - |
| dc.citation.conferenceName | 14th International Conference on Thermal Engineering and Thermogrammetry | - |
| dc.citation.conferencePlace | 헝가리 | - |
| dc.citation.conferencePlace | 부다페스트 | - |
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