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Flexible integrated OLED substrates prepared by printing and plating process
- Authors
- Cho, Doo-Hee; Kwon, O Eun; Park, Young-Sam; Yu, Byoung Gon; Lee, Jonghee; Moon, Jaehyun; Cho, Hyunsu; Lee, Hyunkoo; Cho, Nam Sung
- Issue Date
- Nov-2017
- Publisher
- ELSEVIER
- Keywords
- Flexible; OLED; Plating; Printing; Substrate
- Citation
- ORGANIC ELECTRONICS, v.50, pp 170 - 176
- Pages
- 7
- Journal Title
- ORGANIC ELECTRONICS
- Volume
- 50
- Start Page
- 170
- End Page
- 176
- ISSN
- 1566-1199
1878-5530
- Abstract
- We developed a cost- effective process to fabricate a flexible integrated organic light- emitting diode (OLED) substrate using a screen printing, an electroless copper plating, and a delamination process. Photolithographic method and expensive material such as silver paste were not used. Green OLED devices with the flexible integrated substrates were successfully fabricated, and the electro-optical characteristics such as leakage current and external quantum efficiency of the flexible OLED devices were comparable to those of OLED devices with a glass substrate. The process of this study is suitable for the low cost production of flexible OLED lighting panels. (C) 2017 Elsevier B.V. All rights reserved.
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Related Researcher
- Lee, Hyunkoo
- 첨단소재·전자융합공학부 (지능형전자시스템전공)