A Single-Chamber System of Initiated Chemical Vapor Deposition and Atomic Layer Deposition for Fabrication of Organic/Inorganic Multilayer Films
- Authors
- Kim, Bong Jun; Park, Hongkeun; Seong, Hyejeong; Lee, Min Seok; Kwon, Byoung-Hwa; Kim, Do Heung; Lee, Young Il; Lee, Hyunkoo; Lee, Jeong-Ik; Im, Sung Gap
- Issue Date
- Jun-2017
- Publisher
- WILEY-V C H VERLAG GMBH
- Citation
- ADVANCED ENGINEERING MATERIALS, v.19, no.6
- Journal Title
- ADVANCED ENGINEERING MATERIALS
- Volume
- 19
- Number
- 6
- URI
- https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/146982
- DOI
- 10.1002/adem.201600819
- ISSN
- 1438-1656
1527-2648
- Abstract
- A single-chamber system capable of depositing both organic and inorganic layers by initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is demonstrated to facilitate the fabrication of organic/inorganic hybrid thin film encapsulation (TFE). The chamber geometry and the process conditions of iCVD and ALD are similar to each other, which enabled the design of the single-chamber system. Both organic and inorganic films deposited via the single-chamber system produces films with their properties equivalent to those deposited in separate iCVD and ALD reactors. Alternating the deposition mode between iCVD and ALD produces organic/inorganic multilayers with outstanding barrier properties as well as optical transparency mechanical flexibility.
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