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적외선 리플로 솔더링시 전자부품의 열적반응 민감도 분석Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering
- Other Titles
- Sensitivity Analysis on the Thermal Response of Electronic Components during Infrared Reflow Soldering
- Issue Date
- Jan-2002
- Publisher
- 대한설비공학회
- Keywords
- Thermal response of electronic components(전자부품의 열적반응); Infrared reflow soldering(적외선 리플로 솔더링); 2-D numerical model(2차원 수치모델); Multimode heat transfer(다중모드 열전달)
- Citation
- 설비공학 논문집, v.14, no.1, pp 1 - 9
- Pages
- 9
- Journal Title
- 설비공학 논문집
- Volume
- 14
- Number
- 1
- Start Page
- 1
- End Page
- 9
- ISSN
- 1229-6422
2465-7611
- Abstract
- The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.
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Collections - 공과대학 > 기계시스템학부 > 1. Journal Articles
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