Micro-Tethering for Fabrication of Encapsulated Inertial Sensors With High Sensitivity
- Authors
- Flader, Ian B.; Chen, Yunhan; Yang, Yushi; Ng, Eldwin J.; Shin, Dongsuk D.; Heinz, David B.; Ortiz, Lizmarie Comenencia; Alter, Anne L.; Park, Woosung; Goodson, Kenneth E.; Kenny, Thomas W.
- Issue Date
- Jun-2019
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Citation
- JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.28, no.3, pp 372 - 381
- Pages
- 10
- Journal Title
- JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
- Volume
- 28
- Number
- 3
- Start Page
- 372
- End Page
- 381
- URI
- https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/2974
- DOI
- 10.1109/JMEMS.2019.2900761
- ISSN
- 1057-7157
1941-0158
- Abstract
- This paper demonstrates a post-fabrication technique for creating highly compliant structures inside a hermetic, wafer-scale encapsulation process. Single crystal silicon micro-tethers were fabricated alongside compliant structures to temporarily provide additional anchoring and increased device rigidity during the fabrication process. This technique mitigates in-process stiction for compliant devices by tethering the large, free-moving structures during fabrication. After successful fabrication, the micro-tethers can be selectively removed by two methods. The first method utilizes a potential voltage difference across the device. Joule heating can be concentrated in the micro-tether and the device separated after supplying requisite heat energy. The second method utilizes mechanical fracturing where a large external force is applied to separate the device from the tether. Micro-tethers in this paper were attached to differential resonant beam accelerometers, and were designed for detachment by each method: Joule heating and mechanical fracture. Our results show that the 40μm thick device can be successfully detached by both methods, indicated by the device sensitivity increase from ~100 Hz/g to ~400 Hz/g.
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