Hierarchical Multiplexing Interconnection Structure for Fault-Tolerant Reconfigurable Chip Multiprocessor
- Authors
- Kim, Yoonjin
- Issue Date
- Dec-2011
- Publisher
- IEEK PUBLICATION CENTER
- Keywords
- Chip multiprocessor (CMP); reconfigurable architecture; interconnection; fault-tolerant computing; low power
- Citation
- JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v.11, no.4, pp 318 - 328
- Pages
- 11
- Journal Title
- JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE
- Volume
- 11
- Number
- 4
- Start Page
- 318
- End Page
- 328
- URI
- https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/12440
- DOI
- 10.5573/JSTS.2011.11.4.318
- ISSN
- 1598-1657
2233-4866
- Abstract
- Stage-level reconfigurable chip multiprocessor (CMP) aims to achieve highly reliable and fault tolerant computing by using interwoven pipeline stages and on-chip interconnect for communicating with each other. The existing crossbar-switch based stage-level reconfigurable CMPs offer high reliability at the cost of significant area/ power overheads. These overheads make realizing large CMPs prohibitive due to the area and power consumed by heavy interconnection networks. On other hand, area/ power-efficient architectures offer less reliability and inefficient stage-level resource utilization. In this paper, I propose a hierarchical multiplexing interconnection structure in lieu of crossbar interconnect to design area/ power-efficient stage-level reconfigurable CMP. The proposed approach is able to keep the reliability offered by the crossbar-switch while reducing the area and power overheads. Experimental results show that the proposed approach reduces area by up to 21% and power by up to 32% when compared with the crossbar-switch based interconnection network.
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