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Low temperature-cured electrically conductive pastes for interconnection on electronic devices

Authors
Lim, HS (Lim, Ho Sun)Kim, SN (Kim, Seung-Nam)Lim, JA (Lim, Jung Ah)Park, SD (Park, Seong-Dae)
Issue Date
Oct-2012
Publisher
ROYAL SOC CHEMISTRY
Citation
JOURNAL OF MATERIALS CHEMISTRY, v.22, no.38, pp.20529 - 20534
Journal Title
JOURNAL OF MATERIALS CHEMISTRY
Volume
22
Number
38
Start Page
20529
End Page
20534
URI
https://scholarworks.sookmyung.ac.kr/handle/2020.sw.sookmyung/147664
DOI
10.1039/c2jm33168c
ISSN
0959-9428
Abstract
Highly conductive pastes were prepared by thermal sintering of silver particles into a polymer matrix. These electrically conductive pastes are composed of a novolac epoxy resin and a trimodal metallic mixture of micron-sized silver flakes, silver microspheres, and silver nanoparticles and can be cured at relatively low temperatures. Our strategy is to cure the epoxy resins at a higher temperature than the sintering temperature of the silver powders to form a good metallic network of the conductive materials. We found that our epoxy-based conducting pastes had a low volume resistivity and high electrical conductivity of 8.9 x 10(-6) Omega cm and 1.1 x 10 5 S cm(-1), respectively, even at a low curing temperature of 250 degrees C. The resulting high conductivity may be attractive for numerous applications in various optoelectronic devices that require low-temperature processing.
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