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Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering in an Oven with Air Injection
- Issue Date
- Nov-2005
- Publisher
- JPNSOCOFMECHANICALENGINEERS
- Keywords
- numerical analysisthermal responseelectronic assemblyforced convection-infrared reflow solderingair injectionparametric study
- Citation
- JSME INTERNATIONAL JOURNAL SERIES B-FLUIDS AND THERMAL ENGINEERING, v.48, no.4, pp 865 - 873
- Pages
- 9
- Journal Title
- JSME INTERNATIONAL JOURNAL SERIES B-FLUIDS AND THERMAL ENGINEERING
- Volume
- 48
- Number
- 4
- Start Page
- 865
- End Page
- 873
- ISSN
- 1340-8054
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Collections - 공과대학 > 기계시스템학부 > 1. Journal Articles
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