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Parametric Study on the Thermal Response of Electronic Assemblies during Forced Convection-Infrared Reflow Soldering
- Authors
- Shin, Jee Young
- Conference Name
- Scientific Society of Measurement, Automation and Thermogrammetry 발표집
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- 헝가리
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- metadata.conference.dc.citation.conferenceName
- 14th International Conference on Thermal Engineering and Thermogrammetry
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